Tacusil® EPA2711FG TDS
Tacusil EPA 2711FG is two-parts general purpose epoxy potting material with good thermal conductivity. It’s medium viscosity and long work time under room temperature and designed for the application with high temperature resistance and impact resistance requirement.
It has good size stability, low shrinkage in curing process and adhesion to versatile substrate, such as metal, ceramic and some engineering plastic.
Tacusil® EPA2701 TDS
Tacusil EPA 2701 is a two-parts low viscosity, high temperature epoxy designed for fiber optic, structure bonding. It’s very purity epoxy offered high strength, low CTE and fast cure properties under elevated temperature. It also has excellent weather resistance, chemical resistance and good adhesion to versatile substrate.
Tacusil® EPA0900P - TDS
Tacusil EPA0900P is a general purpose, low viscosity epoxy potting designed for PCBA, electric components potting. It's no filler formula resin, long pot with excellent resistance to acids, bases, water, and most organic compounds.
Tacusil® EPA 0133 - TDS
Tacusil EPA0133 is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low CTE combined with a moderate free flowing viscosity. This resin
contains high volume of special sphere type aluminum oxidant filler, which is less abrasive to meter-mixing
and dispensing equipment comparative with traditional aluminum oxidant filler.
