Tacusil® UVA0202 TDS
Tacusil UVA0202 is a semi-flowable paste with thixotropy, general purpose UV glue that bonds well to engineered plastics and metal substrates. This product don’t contain no-reactive solvent and fast cure upon exposure to UV light.
Tacusil® UVA0202 Blue TDS
Tacusil UVA0202 Blue is a semi-flowable paste with thixotropy, general purpose UV glue that bonds well to engineeredplastics and metal substrates. This product don’t contain no-reactive solvent and fast cure upon exposure to UV light.
Because of oxygen inhibition on its surface during curing process, short wave length UV light as 260nm will reduce its surface tacky. This product is Halogen free and full complaint with RoHS directive 2011/65/EU and Reach directive 1907/2006(SVHC: 201 Items)
Tacusil® UA1008 TDS
Tacusil UA1008B is a reactive hot-melt adhesive with longer setting time. It’s PU base single component material with secondary moisture cure system, which has good adhesion to versatile substrates, such as PC, ABS, glass and most of metal.
Tacusil® UA1003 TDS
Tacusil UA1003 is a fast setting reactive hot-melt adhesive. It’s PU base single component material with secondary moisture cure system, which has good adhesion to versatile substrates, such as PC, ABS, glass and most of metal.
Tacusil® SIA0210TC TDS
Tacusil SIA0210TC is two parts silicone potting material with high thermal conductivity. It’s low viscosity, low hardness and cure well without catalyst poison phenomenon. It can be reworkable and easily peeled off without residue, special for the application in Fiber Optic Device Assembly.
Tacusil® SIA0210-15 TDS
Tacusil SIA0210-15 is two-part high viscosity silicone potting. It’s water clear with long elongation, low hardness and stress in curing process. It can be reworkable and pass long time HTHM test, special for application in fiber optic device assembly and lighting components potting
Tacusil® SIA0210-11 TDS
Tacusil SIA0210-11 is two-parts additive silicone potting adhesive. It’s water clear with long elongation, low hardness and stress in curing process and post HTHM test process. It can be reworkable and easily peeled off without residue, special for the application in Fiber Optic Device Assembly. It’s update version of Tacusil SIA0210 in transparency and modification in mix ratio.