Tacusil® PUA 505 TDS
Tacusil PUA505 is a two-parts fast gel polyurethane adhesive. It has good adhesion to versatile substrate including metal, ceramic and plastic.
Tacusil® PUA 501R TDS
Tacusil PUA501R Black is a two-part black polyurethane that will cure at room temperature. It is commonly used for LED encapsulation,doming, along with other high quality castings. This product has been formulated to provide excellent long-term non yellowing UV stability. It has a low viscosity and is easy to mix and process.
Tacusil® PUA 501 TDS
Tacusil PUA501 Clear is a two-part clear, colorless polyurethane that will cure at room temperature. It is commonly used for LED encapsulation,doming, along with other high quality castings. This product has been formulated to provide excellent long-term non yellowing UV stability, high transparency and water white clarity. It has a low viscosity and is easy to mix and process.
Tacusil® EPA3082 Black TDS
Tacusil EPA3082 Black is a two part unfilled epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough and flexible polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are enhanced by its high elongation giving it the ability to absorb diffe
Tacusil® EPA3082 Clear TDS
Tacusil EPA3082 Clear is a two part unfilled epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough and flexible polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are enhanced by its high elongation giving it the ability to absorb diffe
Tacusil® EPA3065 TDS
Tacusil EPA 3065 is one-part heat cure 100% solids epoxy adhesive. It’s high viscosity with thixotrophy and long work time under room temperature and designed for bonding application with high temperature resistance special for electronic component potting and bonding.